TE1 stabilized SWIR OEM module


The XSW-320 SWIR module is a shortwave infrared OEM module with a resolution of 320 x 256 pixels and a pixel pitch of 20 µm. It is equipped with a single-stage thermoelectric cooler which guarantees low noise and dark current characteristics. The XSW-320 is available with a variety of interfaces and has a small form factor, low weight and low power consumption (SWaP). This makes this SWIR OEM module easy to integrate into your industrial or security system.

The XSW-320 SWIR module can look through glass so you can use standard available (C-Mount) glass lenses and protective housings.




  • 2 versions available
    We offer a basic 100 Hz version and an advanced 400 Hz version
  • Easy connectivity
    Various interfaces available
  • Made in Europe
    Easy to export - no ITAR restrictions
  • Small 20µm pixel pitch
    Excellent trade off between sensitivity, noise and format


  • Food inspection
    Bruises on food can be detected due to the higher moisture content which will appear darker in the SWIR images
  • Hyperspectral imaging
    Combination of spectral imaging and 2D imaging. Our SWIR camera are used for hyperspectral SWIR imaging
  • Laser beam profiling
    Laser beam analysis for infrared lasers at, e.g., 1064, 1300 and 1550 nm
  • Night vision
    SWIR imagers can be used for day and starlight imaging
  • Semiconductor inspection
    SWIR cameras are able to see through silicon
  • Solar cell inspection
    Inspection techniques for crack inspection or efficiency mapping based on electroluminescence or photoluminescence
  • Waste sorting
    SWIR camera are used to check and compare reflectance values for different waste materials


Compatible with a variety of framegrabbers

Several compatible frame grabbers for CameraLink interface are available (Euresys Grablink Full, NI 1433 and Imperx Framelink Express VCE-CLEX01).

GigE Vision standard compatibility

The Gigabit Ethernet interface is compatible to the GigE Vision standard

Video output

Analog video output available

SWaP (Small size, weight and power )

Small volume, low weight and low power consumption for demanding applications


External trigger for signal synchronization

Windowing mode

Imaging in a reduced window of interest for increased frame rates

TrueNUC image correction

Non uniformity correction for a wide range of integration times

High dynamic range

High dynamic range mode available


芯片参数 XSW-320
Array type InGaAs Focal Plan Array (FPA) ROIC with CTIA topology
Resolution 320 x 256
Pixel pitch 20 μm
Spectral band 0.9 μm to 1.7 μm
Pixel operability > 99 %
Readout mode Integrate Then Read (ITR)
Array cooling TE1-stabilized
ROIC noise 60 e-
Dark current 0.19 x 10? e-/s/pixel or 30 fA @ 200 mV bias at 288 K
Full well capacity 125 k e-
Module Specifications XSW-320-Samtec XSW-320-Analog XSW-320-GigE XSW-320-CL
Maximum frame rate (full frame) 100 Hz or 400 Hz
Window of interest Minimum size 32 x 4 (only for 400 Hz model)
Exposure time range 1 μs to 40 ms
Noise 110 e-
Dynamic range 61 dB
ADC 14 bit
On-board image processing Auto-Gain, Auto-Offset Auto-Gain, Auto-Offset, Auto-Exposure
Optical interface C-mount
Digital output 16bitDV/BT.656 - GigE Vision CameraLink
Analog output - PAL or NTSC -
Module control Samtec RS232 (XSP) GigE Vision CameraLink
Trigger Trigger in or out (configurable)
Power requirements
Power consumption 2.5 W 3 W 4 W 2.8 W
Power supply 12 V
Physical characteristics
Ambient operating temperature range -40oC to 70oC (industrial components)
Storage temperature range -40oC to 85oC (industrial components)
Dimensions (W x H x L mm?) 45 x 45 x 51 45 x 45 x 55 45 x 45 x 65 45 x 45 x 55
Weight module 120 g 145 g 165 g 129 g



Xeneth LabVIEW软件开发套件(SDK)

Xenics摄像机的LabVIEW工具套件可提供 高水平的范例以及低水平的VI案例,便于编程人员将Xenics 摄像机集成到他们使用LabVIEW编写的软件 应用中。

Jan Šíma, Business Development Manager, ELCOM, a.s.