Uncooled thermal OEM module


Xenics XTM-384 is an extremely compact and versatile camera module with unique image quality and stability for a broad range of OEM applications. These applications include security, night vision, firefighting, airborne and land-based reconnaissance and surveillance.

We guarantee you unparalleled uniform and crisp thermal images thanks to onboard image processing and full shutter control. You can easily integrate our XTM-384 into your system with the universal Samtec QTE connector, providing digital video out or raw digital data. This allows you immediate connection, data acquisition, command and control.

The pixel pitch of 25 µm guarantees great Detection, Recognition and Identification (DRI) values in the most critical security applications.




  • Small size
    Small formfactor thermal imaging core with excellent image quality
  • Low power
    Low power consumption for easy integration, also in portable systems
  • 25 µm pixel pitch
    The small pixel pitch results in Great Detection, Recognition and Identification (DRI) values
  • Easy connectivity
    Various interfaces available
  • 84 Hz frame rate (full frame)
    The XTM-384 is able to deliver 84 frames per second


    Small and lightweight thermal imaging core
  • Gimbal
    Small and lightweight thermal imaging core. Suitable for integration into a Gimbal
  • Night vision
    Thermal imagers detect heat signatures at night.
  • Thermal sights
    Integrate XTM cores in portable thermal sights for target acquisition
  • Border security
    Thermal imagers detect heat signatures at night.
  • Fire fighting
    The XTM thermal OEM module is able to detect hotspots
  • Driver assistance
    Thermal imagers detect heat signatures at night
  • Police surveillance
    Thermal imagers detect heat signatures in darkness
  • Search and rescue (SAR)
    Thermal imagers are able to detect heat from subject. SWIR images can be illuminated by moonlight and starlight. Essential for night search and rescue operations.
  • Electro optical payloads
    XTM and XSW cores can be used as thermal and electro optical payloads for UAV platforms


2 years warranty

Xenics has extended the standard warranty to 2 years

Extremely compact

Small form-factor product

Compatible with a variety of framegrabbers

Several compatible frame grabbers for CameraLink interface are available (Euresys Grablink Full, NI 1433 and Imperx Framelink Express VCE-CLEX01).

GigE Vision standard compatibility

The Gigabit Ethernet interface is compatible to the GigE Vision standard

Day & Night Vision

The module can operate under daylight or nighttime conditions

SWaP (Small size, weight and power )

Small volume, low weight and low power consumption for demanding applications


External trigger for signal synchronization

Windowing mode

Imaging in a reduced window of interest for increased frame rates

16 bit image

Digitization: The module uses a 16 bit ADC

Video output

Analog video output available


芯片参数 XTM-384  
Array type Uncooled microbolometer (a-Si)
Resolution 384 x 288
Pixel size 25 μm x 25 μm
Spectral band 8 μm to 14 μm
Pixel operability > 99 %
Array cooling Uncooled
Thermal sensitivity (NETD) 60 mK @ 30°C with f/1 lens
Module Specifications XTM-384-QTE XTM-384-GigE XTM-384-CL XTM-384-Analog
Imaging performance
Maximum frame rate (full frame) 84 Hz 25 Hz (PAL) or 30 Hz (NTSC)
Window of interest Minimum size 160 x 80
Integration time range 1 μs - 70 μs
Integration type Rolling shutter
ADC 16 bit
On-board image processing Non-Uniformity Correction, Auto-Offset & Auto-Gain with selectable region of interest, Histogram equalization Non-Uniformity Correction, Auto-Offset, Auto-Gain Non-Uniformity Correction, Auto-Offset & Auto-Gain with selectable region of interest, Histogram equalization
Module control Serial LVCMOS 3 V (XSP) GigE Vision RS232 (XSP)
Digital output BT.601-6/BT.656-5 GigE Vision or Xeneth API/SDK CameraLink or Xeneth API/SDK -
Analog output - PAL or NTSC
Trigger Trigger in or out (configurable)
Operating mode Stand-alone or PC-controlled
Power requirements
Power consumption 1.65 W < 4.5 W < 2 W
Power supply 3.3 V 12 V
Physical characteristics
Shock 40 G, 11 ms according to MIL-STD810G
Vibration 5 G (20 Hz to 2000 Hz) according to MIL-STD883J
Ambient operating temperature range -40oC to 60oC (industrial components)
Storage temperature range -40oC to 85oC (industrial components)
Dimensions (W x H x L mm?) 45 x 45 x 36 45 x 45 x 62 45 x 45 x 44.6
Weight module 75 g 125 g 84 g 99 g



  • Xeneth Basic
  • Xeneth Advanced
  • Xeneth SDK
  • Xeneth Labview SDK


Xenics at SPIE DSS 2011: high performance infrared OEM modules for easy integrationWe offer high resolution infrared OEM modules in both SWIR (XSW-640) as LWIR (XTM-640) (2011)
Xenics sees strong growth ahead for OEM module businessThe OEM module business will grow strongly, especially in the security market. That is why we target the security market with our XenicsCores (2014)

Xeneth LabVIEW软件开发套件(SDK)

Xenics摄像机的LabVIEW工具套件可提供 高水平的范例以及低水平的VI案例,便于编程人员将Xenics 摄像机集成到他们使用LabVIEW编写的软件 应用中。

Jan Šíma, Business Development Manager, ELCOM, a.s.